ISO 15754 (Paper & board): Z-directional tensile strength (ZDT) test

ISO 15754:2009 is a paper and board test method for determining z-directional tensile strength (often called ZDT or “internal bond” strength), meaning tensile strength through the thickness of the sheet.

This method is commonly specified when you need to compare ply bonding, delamination resistance, or internal layer integrity in multi-ply paperboard and similar grades. If you need help determining whether ISO 15754 is appropriate for your product type or how to align equipment settings to the cited edition, you can talk with our team.

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ISO 15754:2009 — Paper and board — Determination of z-directional tensile strength

ISO 15754 specifies a laboratory method to measure tensile strength in the z-direction (perpendicular to the sheet plane) for paper and board. It is applicable to paper and board, but it does not apply to corrugated fibreboard.


Quick definition

What it measures: Maximum tensile force per bonded test area required to separate a paper/board specimen through its thickness.

How it is commonly described: A Z-direction tensile (ZDT) or internal bond-type test using platens and a controlled loading rate, with the specimen bonded to the platens using double-sided adhesive tape.


What this standard covers

ISO 15754 focuses on the through-thickness tensile performance of paper and board structures. The method mounts the test piece between opposing platens using double-sided adhesive tape, then applies a tensile separation load to produce a z-direction failure and determine the z-directional tensile strength.

This is a targeted property test; it is not a general tensile test for in-plane strength, elongation, or modulus.


Why this standard matters in testing

Z-directional tensile strength is often used as an indicator of internal bonding quality and resistance to ply separation. Buyers and QA/QC teams use it to track process stability (furnish, refining, wet-end chemistry, pressing/drying effects) and to compare product constructions where delamination risk is a concern.

Because bonding tape, platen condition, and rate control can influence results, consistency of setup is critical when trending data over time or comparing results between sites.


Common materials, product types, or applications covered

ISO 15754 is commonly applied to:

  • Paperboard and multi-ply board where internal layer bonding is performance-critical
  • Paper and board grades where delamination resistance is used as a quality attribute
  • Converting and packaging material evaluations where internal bond integrity affects runnability and end-use durability

It is explicitly not intended for corrugated fibreboard.


Common test or verification workflow

A typical ISO 15754 workflow includes specimen sampling (when applicable), conditioning, test piece preparation, bonding to platens using specified adhesive tape and a controlled compression/bonding step, then tensile separation under a defined rate-control requirement.

Common workflows: Incoming material approval, process change validation, supplier comparison, ongoing production QC trending, and investigation of splitting/delamination complaints.

Practical caution: This is a method where equipment stiffness, surface condition of platens, tape selection, and bonding pressure/time can materially affect repeatability. For meaningful comparisons, keep these variables controlled and document them in the report set.


Equipment commonly used for this standard

ISO 15754 is typically run on a z-direction tensile / internal bond tester or a universal testing machine configured with a ZDT platen fixture. The setup is centered on pulling two parallel platens apart while maintaining alignment and a controlled loading rate.

Common equipment: Z-direction tensile (ZDT) fixture with opposing platens, a tensile test frame with suitable force range and speed control, compression/bonding device for consistent tape-to-specimen and tape-to-platen bonding, cutting tools for preparing pieces larger than the platen area, and cleaning supplies/solvent compatible with platen maintenance.

If you are selecting a tester or fixture package (including platen size options, force capacity, and control features to meet the standard’s rate requirement), you can request a detailed quote for a configuration matched to your throughput and reporting needs.


How to read this designation or revision

Designation format: ISO 15754:2009.

What the year means: “2009” indicates the publication year of the referenced edition. When contracts, purchase specifications, or quality plans cite ISO 15754, results and settings should be aligned to the exact cited edition because apparatus details and rate-control requirements can be edition-sensitive.

Status note: ISO’s catalog record indicates the 2009 edition has been reviewed and confirmed (most recently in 2025), so it remains the current edition unless a newer revision is explicitly cited for your program.


Related standards, methods, or frameworks

ISO 15754 is often used alongside standard paper/board sampling and conditioning practices when material lots are being evaluated. In many labs, similar Z-direction / internal bond testing is also performed under TAPPI methods for comparable use cases, depending on customer requirements and regional practice.

Related references commonly encountered: ISO 186 (sampling of paper and board), ISO 187 (standard atmosphere for conditioning and testing of paper, board and pulps), and TAPPI T 541 (Z-direction tensile / internal bond-type testing).


Talk with us about ISO 15754 test capability

If you are upgrading from a legacy internal bond tester, adding ZDT capability to a universal testing platform, or standardizing platen size and control settings across sites, we can help you scope the right configuration. Share your sample type, target range, and throughput goals and request pricing for an ISO 15754-ready setup.