Precision wafer cut is most often applied with a diamond wafering blade. For some materials, however, cubic boron nitride (or CBN) is the more appropriate and efficient watering blade to use. Optimal wafer cutting is also done by optimizing the abrasive size and concentration, and choosing the most suitable cutting load and speed.

Precision wafer cutting is applied to section extremely delicate samples and to section samples to a quite precise location. Typically, precision wafering saws are equipped with micrometers to accurately align and position the samples. They also have variable cutting land loading speed control.

The typical precision wafering saw ranges in speed from 50 to 1500 rpm or 300 to 3000 rpm. Faster saws are needed to section extremely hard materials like treated steals, minerals, and ceramics.